NVIDIA Details Open Designs for AI Power, Cooling and Networking
HPCwire, Tuesday, October 13th, 2026
At OCP Summit 2026, NVIDIA contributed Vera Rubin rack and tray designs and MGX specs for power, cooling and networking.
NVIDIA used the Open Compute Project Global Summit to contribute open designs for AI factory infrastructure.
These include Vera Rubin rack and compute tray designs through its MGX architecture covering power, cooling and mechanical systems, with a fully liquid-cooled, cable-, hose- and fan-free modular tray, plus an updated MGX specification supporting racks of up to about 250kW.
On networking, NVIDIA and Cisco announced an ultra-dense small form-factor pluggable standard for 400Gb/s fabrics.
NVIDIA says the contributions aim to speed AI factory buildouts by letting the ecosystem standardize and build supply chains around common designs.