Supermicro Expands Integrated Open Compute Project Portfolio to Accelerate Rack-Scale AI Data Center Deployments
SuperMicro, Tuesday, October 13th, 2026
Supermicro expanded its OCP-accepted systems, ORv3/ORW racks and rear door heat exchangers under DCBBS.
Supermicro announced an expanded portfolio of Open Compute Project Accepted systems, racks and rear door heat exchangers, integrated through its Data Center Building Block Solutions.
The portfolio spans rack-scale AI and HPC systems, ORv3 and ORW racks with 48V DC busbars, DLC-2 liquid cooling, networking, in-rack CDUs and RDHx units ranging from 10 kW to 120 kW of cooling.
Supermicro says the integrated approach speeds deployment and time-to-online for AI data centers.